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面向异构集成应用的“片上”嵌入式冷却技术的研究进展 Review

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

《工程（英文）》 2023年第26卷第7期页码 185-197 doi: 10.1016/j.eng.2022.10.019

摘要：

The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chip modules, or in vertically stacked three-dimensional (3D) integrated circuits. Flux values have increased exponentially with a simultaneous reduction in chip size and a significant increase in performance, leading to increased heat dissipation. The electronics industry and the academic research community have examined various solutions to tackle skyrocketing thermal-management challenges. Embedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlike separable cold plates/heat sinks. Although embedding the cooling solution onto an electronic chip results in a high heat transfer potential, technological risks and complexity are still associated with the implementation of these technologies and with uncertainty regarding which technologies will be adopted. This manuscript discusses recent advances in embedded cooling, fluid selection considerations, and conventional, immersion, and additive manufacturing-based embedded cooling technologies.

关键词：电子冷却嵌入式冷却浸入式冷却

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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

《能源前沿（英文）》 2018年第12卷第1期页码 109-120 doi: 10.1007/s11708-018-0540-8

摘要： The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot spots. This study focuses on establishing a holistic optimization methodology for such thermoelectric coolers, in which a thermoelectric element’s thickness and the electrical current are optimized to minimize source temperature with respect to ambient, when the thermal and electrical parasitic effects are considered. It is found that when element thickness and electrical current are optimized for a given system architecture, a “heat flux vs. temperature difference” Pareto frontier curve is obtained, indicating that there is an optimum thickness and a corresponding optimum current that maximize the achievable temperature reduction while removing a particular heat flux. This methodology also provides the possible system level Δ ’s that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling for that architecture. In this study, use was made of an extensive analytical model, which was verified using commercially available finite element analysis software. Through the optimization process, 3 pairs of master curves were generated, which were then used to compose the Pareto frontier for any given system architecture. Finally, a case study was performed to provide an in-depth demonstration of the optimization procedure for an example application.

关键词： thermoelectric cooling thermal management optimization high flux electronics

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Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers

Haiyan LI, Jing LIU

《能源前沿（英文）》 2011年第5卷第1期页码 20-42 doi: 10.1007/s11708-011-0139-9

摘要： Water is perhaps the most widely adopted working fluid in conventional industrial heat transport engineering. However, it may no longer be the best option today due to the increasing scarcity of water resources. Furthermore, the wide variations in water supply throughout the year and across different geographic regions also makes it harder to easily access. To address this issue, finding new alternatives to replace water-based technologies is imperative. In this paper, the concept of a water-free heat exchanger is proposed and comprehensively analyzed for the first time. The liquid metal with a low melting point is identified as an ideal fluid that can flexibly be used within a wide range of working temperatures. Some liquid metals and their alloys, which have previously received little attention in thermal management areas, are evaluated. With superior thermal conductivity, electromagnetic field drivability, and extremely low power consumption, liquid metal coolants promise many opportunities for revolutionizing modern heat transport processes: serving as heat transport fluid in industries, administrating thermal management in power and energy systems, and innovating enhanced cooling in electronic or optical devices. Furthermore, comparative analyses are conducted to understand the technical barriers encountered by advanced water-based heat transfer strategies and clarify this new frontier in heat-transport study. In addition, the unique merits of liquid metals that could lead to innovative heat exchanger technologies are evaluated comprehensively. A few promising industrial situations, such as heat recovery, chip cooling, thermoelectricity generation, and military applications, where liquid metals could play irreplaceable roles, were outlined. The technical challenges and scientific issues thus raised are summarized. With their evident ability to meet various critical requirements in modern advanced energy and power industries, liquid metal-enabled technologies are expected to usher a new and global era of water-free heat exchangers.

关键词： heat exchanger liquid metal water resource heat transport enhancement coolant thermal management process engineering energy crisis chip cooling

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

《机械工程前沿（英文）》 2012年第7卷第1期页码 29-37 doi: 10.1007/s11465-012-0314-7

摘要：

Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

关键词： flip chip defect detection ultrasonic excitation vibration analysis

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

《机械工程前沿（英文）》 2013年第8卷第2期页码 118-126 doi: 10.1007/s11465-013-0253-y

摘要：

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.

关键词： LED chip sorter multi-domain modeling and simulation parameter optimization modelica language

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

《机械工程前沿（英文）》 2017年第12卷第4期页码 581-590 doi: 10.1007/s11465-017-0454-x

摘要：

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

关键词： electric field microsensor three-dimensional single-chip in-plane rotation

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Study on forced air convection cooling for electronic assemblies

LI Bin, TAO Wenquan, HE Yaling

《能源前沿（英文）》 2008年第2卷第2期页码 158-163 doi: 10.1007/s11708-008-0009-2

摘要： The slotted fin concept was employed to improve the air cooling performance of plate-fin in heat sinks. Numerical simulations of laminar heat transfer and flow pressure drop were conducted for the integral plate fin, discrete plate fin and discrete slotted fin heat sinks. It is found that the performance of the discrete plate fin is better than that of the integral continuum plate fin and the performance of slotted fin is better than that of the discrete plate fin at the same pumping power of the fan. A new type of heat sink characterized by discrete and slotted fin surfaces with thinner fins and smaller spaces between fins is then proposed. Preliminary computation shows that this type of heat sink may be useful for the next generation of higher thermal load CPUs. The limit of cooling capacity for air-cooling techniques was also addressed.

关键词： concept slotted air-cooling Preliminary computation generation

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Energy efficiency of small buildings with smart cooling system in the summer

Yazdan DANESHVAR, Majid SABZEHPARVAR, Seyed Amir Hossein HASHEMI

《能源前沿（英文）》 2022年第16卷第4期页码 651-660 doi: 10.1007/s11708-020-0699-7

摘要： In this paper, a novel cooling control strategy as part of the smart energy system that can balance thermal comfort against building energy consumption by using the sensing and machine programming technology was investigated. For this goal, a general form of a building was coupled by the smart cooling system (SCS) and the consumption of energy with thermal comfort cooling of persons simulated by using the EnergyPlus software and compared with similar buildings without SCS. At the beginning of the research, using the data from a survey in a randomly selected group of hundreds and by analyzing and verifying the results of the specific relationship between the different groups of people in the statistical society, the body mass index (BMI) and their thermal comfort temperature were obtained, and the sample building was modeled using the EnergyPlus software. The result show that if an intelligent ventilation system that can calculate the thermal comfort temperature was used in accordance with the BMI of persons, it can save up to 35% of the cooling load of the building yearly.

关键词： smart home heating and cooling systems saving energy optimal consumption of energy

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

《农业科学与工程前沿（英文）》 2023年第10卷第3期页码 448-457 doi: 10.15302/J-FASE-2023490

摘要：

● Low-value biowaste including wood chip and potato peel was valorized to syngas.

关键词： Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip

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A concept of capillary active, dynamic insulation integrated with heating, cooling and ventilation, air

Mark BOMBERG

《结构与土木工程前沿（英文）》 2010年第4卷第4期页码 431-437 doi: 10.1007/s11709-010-0071-9

摘要： When a historic fa?ade needs to be preserved or when the seismic considerations favor use of a concrete wall system and fire considerations limit exterior thermal insulation, one needs to use interior thermal insulation systems. Interior thermal insulation systems are less effective than the exterior systems and will not reduce the effect of thermal bridges. Yet they may be successfully used and, in many instances, are recommended as a complement to the exterior insulation. This paper presents one of these cases. It is focused on the most successful applications of capillary active, dynamic interior thermal insulation. This happens when such insulation is integrated with heating, cooling and ventilation, air conditioning (HVAC) system. Starting with a pioneering work of the Technical University in Dresden in development of capillary active interior insulations, we propose a next generation, namely, a bio-fiber thermal insulation. When completing the review, this paper proposes a concept of a joint research project to be undertaken by partners from the US (where improvement of indoor climate in exposed coastal areas is needed), China (indoor climate in non-air conditioned concrete buildings is an issue), and Germany (where the bio-fiber technology has been developed).

关键词： capillary active insulation integrated heating cooling and ventilation air conditioning (HVAC) and building enclosure dynamic insulation switchable thermal resistance variable U-value walls

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evaluation of an improved biomass-fired cogeneration system simultaneously using extraction steam, cooling

《能源前沿（英文）》 2022年第16卷第2期页码 321-335 doi: 10.1007/s11708-021-0741-4

摘要： An advanced cogeneration system based on biomass direct combustion was developed and its feasibility was demonstrated. In place of the traditional single heat source (extraction steam), the extraction steam from the turbine, the cooling water from the plant condenser, and the low-pressure feedwater from the feedwater preheating system were collectively used for producing district heat in the new scheme. Hence, a remarkable energy-saving effect could be achieved, improving the overall efficiency of the cogeneration system. The thermodynamic and economic performance of the novel system was examined when taking a 35 MW biomass-fired cogeneration unit for case study. Once the biomass feed rate and net thermal production remain constant, an increment of 1.36 MW can be expected in the net electric production, because of the recommended upgrading. Consequently, the total system efficiency and effective electrical efficiency augmented by 1.23 and 1.50 percentage points. The inherent mechanism of performance enhancement was investigated from the energy and exergy aspects. The economic study indicates that the dynamic payback period of the retrofitting project is merely 1.20 years, with a net present value of 5796.0 k$. In conclusion, the proposed concept is validated to be advantageous and profitable.

关键词： biomass-fired cogeneration district heat production system absorption heat pump extraction steam cooling water low-pressure feedwater

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

《机械工程前沿（英文）》 2017年第12卷第2期页码 203-214 doi: 10.1007/s11465-017-0421-6

摘要：

Predictive models for machining operations have been significantly improved through numerous methods in recent decades. This study proposed a 3D finite element modeling (3D FEM) approach for the micro end-milling of Al6061-T6. Finite element (FE) simulations were performed under different cutting conditions to obtain realistic numerical predictions of chip flow, burr formation, and cutting forces. FE modeling displayed notable advantages, such as capability to easily handle any type of tool geometry and any side effect on chip formation, including thermal aspect and material property changes. The proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip. The prediction capability of the FE model was validated by comparing numerical model and experimental test results. Burr dimension trends were correlated with force profile shapes. However, the FE predictions overestimated the real force magnitude. This overestimation indicates that the model requires further development.

关键词： 3D finite element modeling micro end-milling cutting force chip formation burr formation

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A comprehensive energy solution for households employing a micro combined cooling, heating and power

Huayi ZHANG, Can ZHANG, Fushuan WEN, Yan XU

《能源前沿（英文）》 2018年第12卷第4期页码 582-590 doi: 10.1007/s11708-018-0592-9

摘要：

In recent years, micro combined cooling, heating and power generation (mCCHP) systems have attracted much attention in the energy demand side sector. The input energy of a mCCHP system is natural gas, while the outputs include heating, cooling and electricity energy. The mCCHP system is deemed as a possible solution for households with multiple energy demands. Given this background, a mCCHP based comprehensive energy solution for households is proposed in this paper. First, the mathematical model of a home energy hub (HEH) is presented to describe the inputs, outputs, conversion and consumption process of multiple energies in households. Then, electrical loads and thermal demands are classified and modeled in detail, and the coordination and complementation between electricity and natural gas are studied. Afterwards, the concept of thermal comfort is introduced and a robust optimization model for HEH is developed considering electricity price uncertainties. Finally, a household using a mCCHP as the energy conversion device is studied. The simulation results show that the comprehensive energy solution proposed in this work can realize multiple kinds of energy supplies for households with the minimized total energy cost.

关键词： energy hub micro combined cooling heating and power generation (mCCHP) thermal comfort robust optimization

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Indoor thermal comfort research on the hybrid system of radiant cooling and dedicated outdoor air system

Weiliang WANG, Zhe TIAN

《能源前沿（英文）》 2013年第7卷第2期页码 155-160 doi: 10.1007/s11708-013-0244-z

摘要： The radiant cooling system generally operates with the dedicated outdoor air system (DOAS). Air supply modes and the corresponding setting parameters of the hybrid system may substantially influence the indoor thermal comfort. With target indexes of air diffusion performance index (ADPI) and predicted mean vote (PMV), the Taguchi method was used to choose the optimal air supply mode and to analyze the significance of different factors on the thermal comfort. The results are expected for conducting the future design and regulation of the hybrid system. Computation fluid dynamics (CFD) simulation as well as verified experiments was performed during the research. Based on the ADPI studies, it is found that the air supply mode of ceiling delivery with ceiling exhaust is an optimized option to apply in DOAS of the hybrid system. Variance analysis results show that influence fact of air supply temperature is the most dominant one to impact the indoor thermal comfort index of PMV.

关键词： radiant cooling system dedicated outdoor air system (DOAS) thermal comfort Taguchi method variance analysis